University of North Texas 
Semiconductor Device Processing
About the Microcredential
- Fee: Free for UNT students enrolled in PHYS 4520
- Modality: Hybrid
- Intended Audience: UNT students enrolled in PHYS 4520
- Approximate Time for Completion: 50 hours
- Author: Dr. Usha Philipose
Semiconductor Device Processing equips learners with foundational techniques in semiconductor fabrication. Designed for UNT undergraduates pursuing careers in the semiconductor industry, this microcredential integrates laboratory safety, cleanroom protocols, and device fabrication processes. Students gain practical experience with techniques such as lithography, etching, metallization, and wire bonding, leveraging the world-class facilities at UNT’s Center for Microelectronics in Extreme Environments (CMEE). Students must be enrolled in PHYS 4520 (Physics of Nanoscale Materials) to enroll in this microcredential.
What You Will Learn
- Laboratory Safety Protocols: Demonstrate proficiency in laboratory safety, including chemical handling, waste disposal, and fume hood usage.
- Cleanroom Procedures: Learn procedures such as proper gowning, contamination control, and equipment operation in Class 100 and Class 10,000 cleanroom environments.
- Semiconductor Fabrication: Experience and execute hands-on training in fabrication processes, including wafer cleaning, lithography, etching, metallization, and wire bonding.
Course Features
- Hybrid Learning Format: Microcredential is delivered in a hybrid format, including both online modules and in-person, hands-on training in semiconductor fabrication processes.
- Comprehensive Content: Focus will be on the application of relevant industry knowledge, skills, and competencies.
- Semiconductor Lab Experience: Hands-on experience, leveraging CMEE’s world-class facilities, including its Cleanroom Facility.
Course Format
- Readings and Videos: Readings and video content to be completed prior to discussions and assignments.
- Knowledge Checks: Assignments and quizzes to help assess comprehension.
- Hands-on Assignments: In-person assignments tailored to real-life situations and job duties, such as cleanroom protocols, wafer cleaning, pattern transfer using lithography (mask aligner) and e-beam/laser write, wet and dry (Reactive Ion Etching – RIE), metallization, and wire bonding.